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�BGA pitch solutions:0.4 mm
�Layers: 1~36
�Microvia & ELIC (Any layer technology)
�Laser Direct Imaging (LDI)/Direct Imaging (DI)
�Via Filling Technology (VIPPO & Cu Filling)
�Min width/***ce�.5/2.5MIL
�Distance between hole and circuit�.15MM
�UV Plugging
�RoHS co***tibility
�spect ratio 15:1
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| Company: |
Willpower Circuit Technology Co.Ltd
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| Contact: |
Ms. Lisa Li |
| Address: |
Shenzhen,518102,Guangdong Province,China |
| Postcode: |
518102 |
| Tel: |
8675533592868 |
| Fax: |
8675533592869 |
| E-mail: |
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